Circuit board assembly for a multiple viewing element endoscope using CMOS sensors
US10488648B2 · kind B2 · utility
2Cited by
138References
13Claims
0Family size
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Key dates
| Filing date | Feb 17, 2017 |
| Grant date | Nov 26, 2019 |
| Priority date | — |
| Expiry date | Jul 25, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04N23/555
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A circuit board design uses CMOS sensors for the tip section of a multi-viewing element endoscope. Side sensors and their optical assemblies are assembled to a common base board to save space. Individual base boards are separately constructed, inserted into grooves of a main base board, and are further connected to the main base board by means of flexible circuit boards.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.