Cooling arrangement for computer system
US10488895B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jan 28, 2015 |
| Grant date | Nov 26, 2019 |
| Priority date | — |
| Expiry date | Jan 28, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20727
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A cooling arrangement for a computer system includes a printed circuit board with first and second heat-generating components; a first heat sink thermally coupled to the first heat-generating component, and a second heat sink thermally coupled to the second heat-generating component; and a first fan that generates an airflow in a direction of the first heat sink, wherein the second heat sink is arranged behind the first heat sink in a direction of airflow generated by the first fan; and an airscoop is arranged between the first heat sink and a blow-out opening of the first fan such that a first part of generated airflow is directly supplied through the airscoop to the first heat sink and a second part of the generated airflow flows around the airscoop and the first heat sink such that the second part of the generated airflow flows to the second heat sink.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.