Additive packaging through smart wrapping of packages and customizations in an on-demand environment
US10489139B2 · kind B2 · utility
1Cited by
69References
24Claims
0Family size
Assignee
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Key dates
| Filing date | Jan 31, 2017 |
| Grant date | Nov 26, 2019 |
| Priority date | — |
| Expiry date | Jan 31, 2037 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F16/00
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Techniques and structures to provide smart packaging in a database environment. A package and a set of customizations corresponding to the package are detected. The package with the set of customizations are bundled to form an additive package such that the additive package provides for the set of customizations to remain bonded with the package throughout one or more processes including testing, deploying, and/or updating of the package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.