Close proximity tunable inductive elements
US10490621B1 · kind B1 · utility
1Cited by
3References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 30, 2018 |
| Grant date | Nov 26, 2019 |
| Priority date | — |
| Expiry date | Jul 30, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30111
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Apparatus implementing various structures to decrease the distance between two inductive elements for tuning an inductance with greater variability (a wider tuning range). One example integrated circuit (IC) package generally includes a laminate, a solder resist layer disposed on an upper surface of the laminate, and a semiconductor die disposed above the laminate and comprising a first inductor. At least a portion of a second inductor is disposed above a section of the solder resist layer, the first inductor at least partially overlaps the second inductor, and there is a gap between the first inductor and the second inductor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.