Semiconductor device and portable apparatus using the same
US10490659B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 27, 2016 |
| Grant date | Nov 26, 2019 |
| Priority date | — |
| Expiry date | Aug 22, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3512
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention provides a semiconductor device that can achieve miniaturization or thinning of the size of the package while maintaining the characteristic of the MOSFET and reducing the on-resistance value, and a portable apparatus using the same. The gate electrodes 26 and 28 of the semiconductor chip 10 are disposed in the vicinity of the two side surfaces of the longitudinal direction (the x axis direction on the page) of the package 2, and the gate terminal 13 and 14 that is mounted with the gate electrodes 26 and 28 in a flip-chip manner are extended in the longitudinal direction of the package 2 and are derived to the outside from the two side surfaces 2A and 2B. Based on the configuration, it is capable of maximizing the size of the semiconductor chip with respect to the size of the package, and it is able to realize the high performance of the element characteristic for the module.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.