Manufacturing method of array substrate, array substrate with active layer being above first electrode, and display device
US10490670B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Jun 20, 2017 |
| Grant date | Nov 26, 2019 |
| Priority date | — |
| Expiry date | Jun 20, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K59/131
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A manufacturing method of an array substrate, an array substrate and a display device are provided. The method includes: forming a first electrode; forming a first insulation layer on the first electrode; forming a first via hole in the first insulation layer; forming an active layer on the first insulation layer, which is electrically connected with the first electrode through the first via hole; forming a gate insulation layer on the active layer; forming a first gate electrode on the gate insulation layer, which overlaps with at least part of the active layer; forming a second insulation layer on the first gate electrode and the gate insulation layer, forming a second via hole in the second insulation layer and the gate insulation layer; forming a pixel electrode on the second insulation layer, which is electrically connected with the active layer through the second via hole.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.