Package and light emitting device
US10490705B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 3, 2018 |
| Grant date | Nov 26, 2019 |
| Priority date | — |
| Expiry date | Aug 3, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/0364
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A package has a bottomed recess with a bottom portion. The package includes: a first electrode having a first outer lead portion and disposed in the bottom portion; a second electrode having a second outer lead portion and disposed in the bottom portion; and a first resin fixing the first electrode and the second electrode and constituting a part of the bottomed recess. The first resin has: a part between the first electrode and the second electrode disposed in the bottom portion; a wall portion constituting side walls of the bottomed recess; and a flange portion having a first part located adjacent to at least one of both sides of the first outer lead portion in plan view. The first part has a thickness different from a thickness of the first outer lead portion. A light emitting has: the package; and a light emitting element mounted on at least one of the first electrode and the second electrode of the package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.