Die bond pad design to enable different electrical configurations
US10490719B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 19, 2016 |
| Grant date | Nov 26, 2019 |
| Priority date | — |
| Expiry date | Oct 19, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/12041
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Light emitting die (300) comprising a plurality of light emitting elements (310A, 310B), each having a pair of bond pads (N1,P1 and N2,P2), wherein at least two diagonally opposite bond pads of adjacent light emitting elements on a die have their facing corners truncated (330) to enable a direct diagonal coupling of a complementary pair of diagonally opposite bond pads when the die is monted on a substrate on which an interconnection pattern is formed. By enabling diagonal as well as lateral coupling of the bond pads of multiple light emitting elements of a die, the multiple light emitting elements may be arranged in a variety of series and/or parallel configurations, thereby facilitating the use of the same die at different nominal operating voltages with a single interconnect layer on the substrate upon which the die is mounted.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.