Packages for high-power laser devices
US10490972B2 · kind B2 · utility
1Cited by
3References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 20, 2017 |
| Grant date | Nov 26, 2019 |
| Priority date | — |
| Expiry date | Jun 20, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/4087
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
In various embodiments, a laser emitter such as a diode bar is cooled during operation via jets of cooling fluid formed by ports in a cooler on which the laser emitter is positioned. The jets strike an impingement surface of the cooler that is thermally coupled to the laser emitter but prevents direct contact between the cooling fluid and the laser emitter itself.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.