Patent · US Active

Interconnect method for implementing scale-up servers

US10491701B2 · kind B2 · utility

0Cited by
5References
16Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJul 14, 2016
Grant dateNov 26, 2019
Priority date
Expiry dateNov 11, 2036

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH04L67/1095
  • WIPO fieldDigital communication
  • WIPO sectorElectrical engineering

Abstract

An embodiment includes a first server including a first processor electrically connected to a second processor; a second server including a third processor electrically connected to a fourth processor; a first connection plane, wherein one of the first and second processors is connected to one of the third and fourth processors by a first connection via the first connection plane and one of the first and second processors is connected to one of the third and fourth processors by a second connection via the first connection plane; and a second connection plane, wherein one of the first and second processors is connected to one of the third and fourth processors by a third connection via the second connection plane and wherein one of the first and second processors is connected to one of the third and fourth processors by a fourth connection via the second connection plane.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.