Method for making housing
US10492319B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Apr 20, 2017 |
| Grant date | Nov 26, 2019 |
| Priority date | — |
| Expiry date | Feb 3, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04M1/0202
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A method of making a housing includes: providing a substrate and cutting the substrate to form an opening. The substrate being spaced by the opening to form at least one main base. A plurality of metal sheets and a plurality of reinforcing members are provided. Placing the metal sheets, the reinforcing members and the main base into a mold. The metal sheets is positioned in the opening, adjusts width of each gap between adjacent metal sheets, and between the main base and one metal sheet adjacent to the main base. Locating the reinforcing members in the metal sheets and the main base. Liquid resin is filled into the gaps and covers the reinforcing members to bond the metal sheets, the main base and the reinforcing members together, forming the housing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.