Element substrate, manufacturing method thereof, printhead, and printing apparatus
US10493774B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 3, 2018 |
| Grant date | Dec 3, 2019 |
| Priority date | — |
| Expiry date | Oct 3, 2038 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2202/18
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
On an element substrate having a multilayered structure in which a temperature detection element is provided in an intermediate layer of a wiring layer and a print element layer, a wiring layer and a temperature detection element formed on the first interlayer insulation film are connected by a first conductive plug which penetrates through the first interlayer insulation film. In addition, a wiring layer and a print element which are formed on the second interlayer insulation film formed on the first interlayer insulation film are connected by a second conductive plug which penetrates through the first and second interlayer insulation films. By manufacturing the element substrate by this arrangement, the thickness of an interlayer insulation film between a print element and a temperature detection element can be made thin, and the sensitivity of the temperature detection element can be improved.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.