MEMS devices and methods of manufacturing the same
US10494252B2 · kind B2 · utility
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2References
19Claims
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Key dates
| Filing date | Sep 22, 2015 |
| Grant date | Dec 3, 2019 |
| Priority date | — |
| Expiry date | Oct 2, 2035 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C2203/0118
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
The present disclosure provides a CMOS MEMS device. The CMOS MEMS device includes a first substrate, a second substrate, a first polysilicon and a second polysilicon. The second substrate includes a movable part and is located over the first substrate. The first polysilicon penetrates the second substrate and is adjacent to a first side of the movable part of the second substrate. The second polysilicon penetrates the second substrate and is adjacent to a second side of the movable part of the second substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.