Benzoxazine low temperature curable composition
US10494520B2 · kind B2 · utility
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Key dates
| Filing date | Mar 4, 2016 |
| Grant date | Dec 3, 2019 |
| Priority date | — |
| Expiry date | Mar 4, 2036 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J2463/00
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present disclosure provides an organic sulfur acid-free composition containing a benzoxazine, phenolic compound and nitrogen-containing heterocyclic compound. The organic sulfur acid-free composition, upon curing at temperatures as low as 130°-140° C., renders void free cured articles having well balanced thermal, chemical and mechanical properties. The organic sulfur acid-free composition may be used in a variety of applications, such as in coatings, structural and non-structural composites and encapsulating systems for electronic and electrical components.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.