Modular sensor package having adhesive-free seal to housing
US10495538B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Sep 18, 2017 |
| Grant date | Dec 3, 2019 |
| Priority date | — |
| Expiry date | Feb 3, 2038 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01L19/143
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A sensor assembly comprising a housing defining a cavity, and a pressure sensor package arranged within the cavity. The pressure sensor package includes a substrate having an aperture defined therethrough, a semiconductor die including a sensing diaphragm attached to the substrate such that the diaphragm is exposed via the aperture, and at least one electrically conductive element in electrical communication with the semiconductor die arranged on the substrate. A sealing element, such as an elastomeric o-ring, provides a seal between the housing and the substrate. A connector is secured to the housing via a crimped connection for establishing electrical connections between the pressure sensor package and an external system.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.