Semiconductor device and ball bonder
US10497662B2 · kind B2 · utility
1Cited by
6References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 24, 2018 |
| Grant date | Dec 3, 2019 |
| Priority date | — |
| Expiry date | Jan 24, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D89/931
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In order to inhibit forming cracks under a pad opening during ball bonding without increasing a chip size, a protective film includes a pad opening that exposes a part of a topmost layer metal film of the chip. A second metal film provided under the pad opening has a ring shape that defines a rectangular opening under the pad opening. The opening edge of the opening in the second metal film extends inwardly beyond the edge of the overlying pad opening. Vias connect the second metal film and the topmost layer metal film, and all of these vias are located outside the pad opening in plan view.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.