Nanoscale LED electrode assembly having improved electrical contact and manufacturing method thereof
US10497680B2 · kind B2 · utility
9Cited by
1References
18Claims
0Family size
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Key dates
| Filing date | Dec 27, 2017 |
| Grant date | Dec 3, 2019 |
| Priority date | — |
| Expiry date | Dec 27, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/0364
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Provided are a method of manufacturing a nanoscale light-emitting diode (LED) electrode assembly having improved electrical contacts, and more particularly, a nanoscale LED electrode assembly having improved electrical contacts and capable of increasing conductivity between electrodes and nanoscale LED devices and decreasing contact resistance, and a method of manufacturing the same.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.