Wedge-shaped fiber array on a silicon-photonic device and method for producing the same
US10497820B1 · kind B1 · utility
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12References
16Claims
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Key dates
| Filing date | Jun 1, 2018 |
| Grant date | Dec 3, 2019 |
| Priority date | — |
| Expiry date | Jun 1, 2038 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/124
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A method of forming a wedge-shaped fiber array and a bottom base according to a probing pad layout of a Si-Photonic device to enable optical, DC and RF mixed signal tests to be performed at the same time and the resulting device are provided. Embodiments include a bottom base; and a fiber array with sidewalls and a top surface having a first angle and a second angle, respectively, over the bottom base, wherein the fiber array is structured to expose bond pads of a Si-Photonic device during wafer level Si-Photonic testing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.