Light emitting device package
US10497846B2 · kind B2 · utility
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1References
20Claims
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Assignee
Inventors
Key dates
| Filing date | Jul 10, 2018 |
| Grant date | Dec 3, 2019 |
| Priority date | — |
| Expiry date | Jul 10, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/831
Abstract
A light emitting device package according to an embodiment includes: a body including first and second openings passing through an upper surface of the body and a lower surface of the body; a light emitting device disposed on the body and including first and second bonding parts; and first and second conductive layers disposed under the body and electrically connected to the first and second bonding parts, respectively, wherein each of the first and second bonding parts includes a protrusion portion protruding and extending in a downwards direction within the first and second openings, respectively.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.