Patch packaging device and method
US10497897B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Apr 29, 2016 |
| Grant date | Dec 3, 2019 |
| Priority date | — |
| Expiry date | Apr 29, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K59/1201
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A patch packaging method and device are provided. The method includes sucking, by a suction mechanism, a loaded cover plate; carrying, by the suction mechanism, the cover plate to move in a direction toward a cavity of a patch packaging mechanism, wherein a substrate to be attached with a patch is placed within the cavity; placing, by the suction mechanism, the cover plate into the cavity, wherein the cover plate, the substrate and side walls of the cavity form an enclosed chamber; extracting, by an air-extraction mechanism, air from the enclosed chamber via an air-outlet hole arranged in the side walls; supplying, by a gas-supply mechanism, a light gas having a density lower than that of the air into the enclosed chamber via a gas-inlet hole arranged in the side walls; and pressing, by a pressing mechanism, the enclosed chamber in such a manner that the cover plate is completely pressed onto the substrate after the light gas is extracted.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.