Microwave or millimeter wave RF part realized by die-forming
US10498000B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 19, 2015 |
| Grant date | Dec 3, 2019 |
| Priority date | — |
| Expiry date | Jun 8, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01Q21/20
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A method and apparatus for producing an RF part of an antenna system is disclosed, as well as thereby producible RF parts. The RF part has at least one surface provided with a plurality of protruding elements. In particular, the RF part may be a gap waveguide. The protruding elements are monolithically formed and fixed on a conducting layer, and all protruding elements are connected electrically to each other at their bases via the conductive layer. The RF part is produced by providing a die having a plurality of recessions forming the negative of the protruding elements of the RF part. The die may be a multilayer die, having several layers, at least some having through-holes to form the recessions. A formable piece of material is arranged on the die, and pressure is applied, thereby compressing the formable piece of material to conform with the recessions of the die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.