Amplifiers and amplifier modules having stub circuits
US10498292B1 · kind B1 · utility
3Cited by
2References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 11, 2018 |
| Grant date | Dec 3, 2019 |
| Priority date | — |
| Expiry date | Jun 11, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10166
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
An amplifier module is provided. The amplifier module includes a multi-layer printed circuit board (PCB). A first power transistor die is mounted at a top surface of the multi-layer PCB. A second power transistor die is mounted at the top surface of the multi-layer PCB. An impedance inversion element is coupled between an output of the first power transistor die and an output of the second power transistor die. A combining node is formed at the output of the second power transistor die. A stub circuit including a transmission line element is coupled at the combining node.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.