Sensor bus architecture for modular sensor systems
US10499123B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 17, 2017 |
| Grant date | Dec 3, 2019 |
| Priority date | — |
| Expiry date | Nov 7, 2037 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02D10/00
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A modular sensor system may include a sensor bus architecture configured for interchangeable sensor modules. Stackable sensor modules, such as rods, may have input/output (I/O) connectivity. The sensor modules may interconnect with a sensor bus head, a sensor bus terminus, and/or one another. The uppermost sensor module may connect to the sensor bus head, and the lowermost sensor module may connect to the sensor bus terminus. Between the sensor bus head and the sensor bus terminus, various sensor modules may be connected. The modular arrangement of the sensors in the system of some embodiments is provided such that the sensors are interconnected through a sensor bus network. The sensor bus communication scheme may allow hot-swapping of sensors and relatively low power operation for energy-constrained sensor data collection applications.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.