High speed differential trace with reduced radiation in return path
US10499490B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Feb 7, 2018 |
| Grant date | Dec 3, 2019 |
| Priority date | — |
| Expiry date | Feb 7, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/0245
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A high speed differential trace structure reducing common mode radiation is disclosed. The differential trace structure includes a first trace and a parallel second trace. A printed circuit board layer has a top surface and an opposite bottom surface. The traces are formed on the top surface. The structure includes a ground plane layer having a top layer in contact with the opposite bottom surface of the circuit board. A first void section is formed in the top layer of the ground plane layer to one side of the first trace. A second void section is formed in the top layer of the ground plane layer to one side of the second trace. The length of the second void section is determined based on a target radiation frequency. A third void section is formed in the ground plane layer that joins the first void section and the second void section.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.