Host computer system and heat dissipation apparatus and separation mechanism thereof
US10499539B2 · kind B2 · utility
0Cited by
4References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 24, 2018 |
| Grant date | Dec 3, 2019 |
| Priority date | — |
| Expiry date | Aug 24, 2038 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2200/201
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A heat dissipation apparatus, adaptable to at least one first circuit device and at least one second circuit device, includes a chassis; and at least one separation mechanism disposed in the chassis, the first circuit device and the second circuit device being respectively disposed at two sides of the separation mechanism, the first circuit device being not aligned with the second circuit device, and the separation mechanism including a separation board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.