Patent · US Active

Process

US10500555B2 · kind B2 · utility

0Cited by

2References

29Claims

0Family size

Assignee

Addivant Switzerland GmbH · CH

Inventors

Jiong Yu · Congers, US
Peter Smith · Mansfield, US
Shengli Gao · Reinach, CH

Key dates

Filing date	Feb 20, 2015
Grant date	Dec 10, 2019
Priority date	—
Expiry date	Oct 14, 2035

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC08K2003/267
WIPO fieldMacromolecular chemistry, polymers
WIPO sectorChemistry

Abstract

The present disclosure relates to a process for forming substantially dust-free additive granules, comprising the steps of:

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.