Methods and apparatuses for high temperature bonding controlled processing and bonded substrates formed therefrom
US10500661B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 6, 2016 |
| Grant date | Dec 10, 2019 |
| Priority date | — |
| Expiry date | Aug 18, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/10272
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Methods and apparatuses for controlled processing of high temperature bonding systems via devices to control heating and cooling systems of a high temperature heating bonding includes use of a sinter fixture device including a plate surface, that is shaped to contact and conform to a contacting surface of a TLPS substrate assembly, and a plurality of channels below the plate surface within a base body of the sinter fixture device shaped to receive heating and cooling elements. A first set of the one or more channels includes a plurality of cross-channels, a cooling medium inlet, and a cooling medium outlet, which cross-channels, cooling medium inlet, and cooling medium outlet are in fluid communication with one another. A second set of the one or more channels includes a plurality of heating element passageways.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.