Dual cure resins containing microwave absorbing materials and methods of using the same
US10500786B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jun 19, 2017 |
| Grant date | Dec 10, 2019 |
| Priority date | — |
| Expiry date | May 11, 2038 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB33Y10/00
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Provided herein according to some embodiments is a method of forming a three-dimensional intermediate object with a polymerizable liquid, said polymerizable liquid comprising a mixture of (i) a microwave absorbing material, (ii) a light polymerizable liquid first component, and (iii) a second solidifiable component that is different from said first component. Optionally, but in some embodiments preferably, the method includes supporting the three-dimensional intermediate with a separate support media prior to solidifying and/or curing the second solidifiable component in the three-dimensional intermediate to form the three-dimensional object; and then optionally separating said support media when present from said three-dimensional object.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.