Substrate structure, method for attaching flexible substrate and method for peeling off flexible substrate
US10500816B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Nov 11, 2016 |
| Grant date | Dec 10, 2019 |
| Priority date | — |
| Expiry date | Jun 5, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K77/111
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A substrate structure and methods for method for attaching a flexible substrate and for peeling off a flexible substrate are disclosed. The substrate structure includes a carrier substrate and a flexible substrate disposed on the carrier substrate, the substrate structure further including a bonding layer interposed between the carrier substrate and the flexible substrate, or more than one bonding layers parallel interposed between the carrier substrate and the flexible substrate, wherein the bonding layer includes an electroviscosity layer, viscous strength of which changes under effect of electric field, the electroviscosity layer is disposed on a contact surface between the bonding layer and the flexible substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.