Printed circuit board fluid ejection apparatus
US10500858B2 · kind B2 · utility
0Cited by
3References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 12, 2018 |
| Grant date | Dec 10, 2019 |
| Priority date | — |
| Expiry date | Mar 12, 2038 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2202/20
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
In an example, a fluid ejection apparatus includes a printed circuit board including a conductor layer, a cover layer forming a surface of the printed circuit board, and a cavity. A printhead die may be embedded in a molding material in the cavity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.