Inkjet printing method for heat sensitive substrates
US10500875B2 · kind B2 · utility
1Cited by
2References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 25, 2016 |
| Grant date | Dec 10, 2019 |
| Priority date | — |
| Expiry date | Oct 25, 2036 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41M5/0011
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
An inkjet printing method using an inkjet printing device including a vacuum support for a substrate held down against a support surface of the vacuum support by air suction includes a step of jetting a set of layers with a set of liquids on the support surface to form a pattern with a surface roughness between 2.0 μm and 200.0 μm and rougher than the surface roughness of the support surface, and a step of supporting the substrate at least partially on the pattern.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.