Method for controlling the thickness of a substrate
US10501359B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 3, 2017 |
| Grant date | Dec 10, 2019 |
| Priority date | — |
| Expiry date | Jan 1, 2038 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC03B2205/40
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A method for controlling the thickness of a glass ribbon and an article produced thereby are provided. The method includes: providing a glass ribbon by drawing from a melt or redrawing from a preform; predefining a nominal thickness of the glass ribbon; determining the thickness of the glass ribbon over its entire net width; determining at least one deviation of the thickness of the glass ribbon from the predefined nominal thickness; identifying the area of the thickness deviation in the glass ribbon; and heating the area of the at least one thickness deviation in the glass ribbon using a laser, so that the glass ribbon attains the predefined thickness.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.