Patent · US Active

Pressure sensitive adhesive assembly suitable for bonding to uneven substrates

US10501591B2 · kind B2 · utility

1Cited by

14References

15Claims

0Family size

Assignee

3M INNOVATIVE PROPERTIES COMPANY · US

Inventors

Jan Heimink · Schwelm, DE
Kerstin Unverhau · Neuss, DE
Andreas Backes · Aachen, DE
Adrian T. Jung · Kaarst, DE
Dirk Hasenberg · Raeren, BE

Key dates

Filing date	Jul 15, 2015
Grant date	Dec 10, 2019
Priority date	—
Expiry date	Apr 29, 2036

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC09J2433/006
WIPO fieldBasic materials chemistry
WIPO sectorChemistry

Abstract

The present disclosure relates to a pressure sensitive adhesive assembly suitable for bonding to a substrate provided with an uneven surface, wherein the pressure sensitive adhesive (PSA) assembly comprises a polymeric foam layer comprising a polymeric base material, and having a complex viscosity comprised between 2,000 Pa·s to 80,000 Pa·s, when measured at 120C according to the test method described in the experimental section. The present disclosure is also directed to a method of applying a pressure sensitive adhesive assembly to a substrate provided with an uneven surface, and uses thereof.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.