Organic film forming composition and electronic apparatus comprising a cured product thereof
US10501655B2 · kind B2 · utility
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14Claims
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Key dates
| Filing date | Jun 15, 2016 |
| Grant date | Dec 10, 2019 |
| Priority date | — |
| Expiry date | Jan 11, 2037 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E10/549
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An organic film forming composition having improved hygroscopic properties (e.g., moisture-adsorbing abilities) and an electronic apparatus including a cured product of the organic film forming composition. The organic film forming composition may include a metal (meth)acrylate represented by Formula 1; and a curable material having at least two curable groups selected from the groups represented by Formulae 2A to 2D:
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.