Gel-type thermal interface material

US10501671B2 · kind B2 · utility

Assignee

• HONEYWELL INTERNATIONAL INC. · US

Inventors

• Liqiang Zhang · Shandong, CN
• Huifeng Duan · Shanghai, CN
• Kai Zhang · Shanghai, CN
• Ya Qun Liu · Shanghai, CN
• Ling Shen · Shanghai, CN
• Wei-Jun Wang · Nanhu, CN
• Haigang Kang · Shanghai, CN

Key dates

• Filing date: Jul 5, 2017
• Grant date: Dec 10, 2019
• Expiry date: Oct 9, 2037

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C08K2201/014
• WIPO field: Macromolecular chemistry, polymers
• WIPO sector: Chemistry

Abstract

A thermal interface material that is useful in transferring heat from heat generating electronic devices, such as computer chips, to heat dissipating structures, such as heat spreaders and heat sinks. The thermal interface material includes at least one silicone oil, and at least one thermally conductive filler.