Constant conductance heat pipe assembly for high heat flux
US10502497B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 24, 2018 |
| Grant date | Dec 10, 2019 |
| Priority date | — |
| Expiry date | Mar 22, 2038 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF28D2021/0028
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A heat pipe assembly that includes at least one axial groove heat pipe and at least one porous media heat pipe. The porous media heat pipe may be embedded into a flange of the axial groove heat pipe, or embedded into a wall of the axial groove heat pipe, or embedded into another bore of the axial groove heat pipe. The evaporator of the at least one porous media heat pipe may be located remotely and can accept a high heat flux, while a condenser of the at least one porous media heat pipe is attached to the axial groove heat pipe.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.