Patent · US Active

Thermopile test structure and methods employing same

US10502631B2 · kind B2 · utility

0Cited by

6References

24Claims

0Family size

Assignee

X-FAB SEMICONDUCTOR FOUNDRIES GMBH · DE

Inventors

Peter Hofmann · Radeberg, DE
Kerst Griesbach · Dresden, DE
Monika Reinhold · Freital, DE

Key dates

Filing date	Jun 16, 2017
Grant date	Dec 10, 2019
Priority date	—
Expiry date	Jul 14, 2037

Classification

Technology area (CPC H)Electricity
CPC primaryH10N10/81
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

A semiconductor product comprising: a semiconductor substrate and a test structure, the test structure comprising: a thermopile and at least one temperature sensitive element, the at least one temperature sensitive element being located in the substrate, or between the substrate and the thermopile.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.