Photosensitive resin composition, photosensitive dry film, photosensitive resin coating, and pattern forming process
US10503067B2 · kind B2 · utility
6Cited by
2References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 30, 2018 |
| Grant date | Dec 10, 2019 |
| Priority date | — |
| Expiry date | Feb 8, 2038 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/40
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A photosensitive resin composition comprising (A) a silicone-modified polybenzoxazole resin and (B) a photoacid generator which is decomposed to generate an acid upon exposure to radiation of 190-500 nm is coated onto a substrate to form a thick coating, which is exposed to radiation, baked, and developed to form a pattern. The resin coating is capable of forming a fine pattern and has improved crack resistance and other film properties, and reliability.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.