Carrier substrate assembly, and fabrication method of flexible display substrate
US10504766B2 · kind B2 · utility
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1References
18Claims
0Family size
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Key dates
| Filing date | Jul 1, 2016 |
| Grant date | Dec 10, 2019 |
| Priority date | — |
| Expiry date | Jul 1, 2036 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P20/582
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present disclosure provides a carrier substrate assembly, and a method of using the carrier substrate assembly, for fabricating a flexible display substrate. The carrier substrate assembly comprises a carrier substrate, which has a central region with a plurality of through-holes and a peripheral region surrounding the central region. The plurality of through-holes are configured to provide passageways for a reaction solution to facilitate separation of the flexible thin film laminated over an upper surface of the carrier substrate from the carrier substrate during the lifting-off of the flexible thin film.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.