Method of batch transferring micro semiconductor structures
US10504872B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Apr 6, 2018 |
| Grant date | Dec 10, 2019 |
| Priority date | — |
| Expiry date | Apr 6, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/12041
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of batch transferring micro semiconductor structures is provided for effectively and efficiently picking up a batch of or a large amount of micro structures and transferring them to a target substrate, so it can be widely applied in transferring a lot of various micro semiconductor structures. The method includes steps of: attaching an adhesive material to a plurality of array-type micro semiconductor structures; and providing a roll-to-attach mechanism for alternately processing linear contacts between the array-type micro semiconductor structures and a target substrate. The array-type micro semiconductor structures are optionally picked up in batch from the adhesive material and transferred in batch to the target substrate as the linear contacts are alternately processed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.