Method for processing silicon material
US10505069B2 · kind B2 · utility
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21Claims
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Key dates
| Filing date | Mar 11, 2016 |
| Grant date | Dec 10, 2019 |
| Priority date | — |
| Expiry date | Sep 5, 2036 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
Abstract
The present disclosure provides a method for accelerating the formation of defects in doped silicon. A doped silicon area is exposed with high intensity electromagnetic radiation to provide a substantial excess of majority carriers and promote a high rate of defect formation to allow efficient silicon passivation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.