Patent · US Active

Component and method of producing a component

US10505091B2 · kind B2 · utility

2Cited by

0References

16Claims

0Family size

Assignee

OSRAM Opto Semiconductors GmbH · DE

Inventors

Norwin von Malm · Nittendorf, DE
Frank Singer · Regenstauf, DE

Key dates

Filing date	Jun 14, 2016
Grant date	Dec 10, 2019
Priority date	—
Expiry date	Aug 5, 2036

Classification

Technology area (CPC H)Electricity
CPC primaryH10H20/882
WIPO fieldElectrical machinery, apparatus, energy
WIPO sectorElectrical engineering

Abstract

A component comprising a support and a semiconductor body arranged on the support, the support formed by a molded body and a metal layer. The metal layer has a first subregion and a second subregion laterally spaced apart by an intermediate space and thereby electrically separated. The molded body fills the intermediate space and has a surface extending in lateral directions free from the subregions of the metal layer and forms the rear side of the support. The support has a side face formed by a surface of the molded body extending in vertical directions, at least one of the subregions formed such that electrical contact can be made by way of the side face.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.