Dual cup enclosure for electronic devices
US10505308B1 · kind B1 · utility
1Cited by
18References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 10, 2018 |
| Grant date | Dec 10, 2019 |
| Priority date | — |
| Expiry date | Sep 10, 2038 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29L2031/3481
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
An enclosure for an electronic device includes a housing having a wall that defines a cavity that is configured to receive an electronic assembly therein. The wall includes tongue formed at a distal end. A cover includes a top wall and a side surface extending from the top wall to form a chamber. The housing is at least partially received within the chamber and the tongue of the housing is welded to a groove positioned within the chamber. Flash from the weld is contained within the enclosure so that no weld flash is visible on the exterior surface of the enclosure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.