Method for making contact wires for sliprings
US10505329B2 · kind B2 · utility
0Cited by
4References
10Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Sep 6, 2017 |
| Grant date | Dec 10, 2019 |
| Priority date | — |
| Expiry date | Apr 26, 2038 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49194
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A method for making contact wires for sliprings comprising the steps of: coating and/or plating a wire with a first metal of the group of nickel, chrome or a combination thereof; coating and/or plating the wire with a second metal of the group of gold, silver, or a combination thereof; delivering laser radiation and generating an interference pattern of the laser radiation to the surface of the wire; heating the surface selectively as defined by the interference pattern, modifying of the crystal structure and/or providing protrusions and/or recesses due to melting and/or evaporation of the surface material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.