Electronic component housing apparatus and electronic device
US10506742B2 · kind B2 · utility
2Cited by
2References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 1, 2016 |
| Grant date | Dec 10, 2019 |
| Priority date | — |
| Expiry date | Dec 1, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20172
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
To provide an electronic component housing apparatus that is able to efficiently cool the heat of a first and second electronic component, a first electronic component housing chamber 5000 houses the high voltage power supply module 100 (the first electronic component). A second electronic component housing chamber 6000 houses the TWT 200 (the second electronic component). At least some of a first partition plate 2500 and a second partition plate 2600 are provided so as to face each other. A first gap part G1 is provided between the first partition plate 2500 and the second partition plate 2600.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.