Device for inductive heating of a component
US10507547B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 16, 2017 |
| Grant date | Dec 17, 2019 |
| Priority date | — |
| Expiry date | Jan 3, 2038 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P10/25
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
The invention relates to a device for inductive heating of a component, having a component placement unit for the component, an induction coil, with which the component can be heated inductively, at least in regions, an electrical lead for the induction coil, and a positioning unit, at which the induction coil is arranged in such a way that it can be brought into different relative arrangements with respect to the component placement unit by way of the positioning unit, wherein the electrical lead is guided over a contact, which is formed by contact surfaces that rest against each other and are shifted in position in relation to each other in the contact position when the induction coil is shifted in position by means of the positioning unit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.