Method and device for dismantling multilayer systems including at least one organic component
US10507597B2 · kind B2 · utility
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8Claims
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Key dates
| Filing date | Sep 2, 2016 |
| Grant date | Dec 17, 2019 |
| Priority date | — |
| Expiry date | Sep 2, 2036 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1928
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Method and device for delamination/dismantling of multi-layer systems SM comprising several layers including at least one organic layer, wherein the layers are separated by interfaces, characterized in that it comprises at least the following steps:
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.