Patent · US Active

Polyamide moulding compounds for large moulded parts

US10507608B2 · kind B2 · utility

0Cited by

4References

36Claims

0Family size

Assignee

EMS-Patent AG · CH

Inventors

Nikolai Lamberts · Bonaduz, CH
Bernd HENKELMANN · Bonaduz, CH
Philipp Harder · Heidelberg, DE

Key dates

Filing date	Nov 12, 2014
Grant date	Dec 17, 2019
Priority date	—
Expiry date	Apr 9, 2036

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB29K2995/0012
WIPO fieldMacromolecular chemistry, polymers
WIPO sectorChemistry

Abstract

The invention concerns polyamide moulding compound, in particular for producing heat-resistant moulded parts, having the following composition: (A) 20 to 79 wt. % of at least one partially aromatic polyamide in the form of a copolyamide which comprises 50 to 80 mol. % units formed by hexanediamine and terephthalic acid; (B) 1 to 15 wt. % of at least one impact-resistant modifier; (C) 20 to 60 wt. % of at least one carbon fibre; and (D) 0 to 5 wt. % of at least one additive, components (A) to (D) adding up to 100 wt. %.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.