Patent · US Active

Soft wrap substrate

US10507610B2 · kind B2 · utility

0Cited by

6References

16Claims

0Family size

Assignee

TOYOTA MOTOR ENGINEERING & MANUFACTURING NORTH AMERICA, INC. · US

Inventors

Benjamin Warren Penner · Ann Arbor, US
Kerry Scott Zellner, Jr. · Saline, US

Key dates

Filing date	Mar 28, 2012
Grant date	Dec 17, 2019
Priority date	—
Expiry date	Nov 23, 2034

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T428/24479
WIPO fieldOther special machines
WIPO sectorMechanical engineering

Abstract

A molded component having a thickness reduction feature is provided. The molded component can include an injection molded polymer substrate having a front panel, a side panel, and a corner between and adjoining the front panel and the side panel. The substrate can also have a groove extending along the corner between the front panel and the side panel, the groove having a front panel edge and a side panel edge. The front panel edge and/or side panel edge have a dentil profile edge, the dentil profile edge reducing an effective thickness of the corner and thus providing increased or controlled cooling of the substrate.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.