Composition and polyamideimide composite and polyamideimide film and electronic device
US10508175B2 · kind B2 · utility
2Cited by
1References
22Claims
0Family size
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Key dates
| Filing date | Sep 29, 2017 |
| Grant date | Dec 17, 2019 |
| Priority date | — |
| Expiry date | Jan 19, 2038 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08G77/80
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A composition including a polyamideimide precursor modified with an alkoxysilane group and an oligosilica compound, wherein the oligosilica compound is a condensation reaction product of an organosilane diol and an alkoxysilane compound.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.